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So, you think you might want to do some? Pull up a chair; there's a lot to talk about. The first thing to know about FPCs is that they are almost entirely different from rigid boards. As much as 90% of the effort is on the mechanical side with 10% place and route. That doesn't mean that the Electrical or Mechanical Engineers are going to be much help. These things are an enigma to pretty much everyone.

Count on re-routing it a few times anyway. For starters, there's the 3-dimensional space puzzle. To visualize the twists, turns and bends that a flex circuit can and will do, it's common to use origami techniques to 'paper-doll' the connectivity.' Start with a piece of paper and a pair of scissors. Represent one connector by marking off pin-one.

Create the general shape of your mock-up. Mark off the other end of the signal while in the final folded form. Flatten the paper out and see if you can draw a coherent line back to the other pin-one. Do this floor-plan thing again before taping out.

If you're able to use pin-one for the same signal through the entire system, you'll have fewer catastrophic failures. Go ahead and ask me how I know this. One Layer at a Time Adding a bit about single layer flexes, the copper is where you would find the dielectric core of a rigid board. So-called neutral axis construction is very clever when the flex has to go through thousands of bend cycles.

The copper is sandwiched between 2 layers of flex materials. Putting the metal in the middle helps eliminate elongation or compression of the conductors. Lower fatigue for longer life is the reason for IPC-6013 type 1.

The most common FPC has two layers - IPC-6013 type 2. At least one end of the flex is likely to have a ZIF connector. ZIF stands for Zero Insertion Force and it works like an edge connector in that it slides into the mating receptacle. More on this later. The other end is normally a low-profile stacking connector with the bendable area in between. Taking this simple idea forward, there will be at least three zones to consider. Zone One, the Connector: The physical connector will be soldered to the flex.

This almost always involves a stiffener on the far side. Common stiffener materials are plain old FR4, aluminum, and stainless steel - that for some reason is called SUS. Polyimide can also be used for a thin backing material. Again, we will revisit this material soon. The point of the stiffener is two-fold. You don't want your solder-joints ripping away from a flimsy ribbon of material. The stiffener will reduce wear and tear over the life of the flex.

The metal ones also make a nice heatsink. The Stack-Up for This Zone Goes: • Connector • Soldermask: It's a special type for flexibility. Pyralux is the Dupont version, but all of the usual suspects make it.

Expansion is much more than you would expect for normal boards. Figure on gang relief.

Silkscreen, if any, will also have to be Kindergarten size. • Plate-up metallization: RA copper (rolled annealed) softened for flexibility. This is the preferred treatment for all copper in an FPC that has to flex in service. • Base metal: Unlike rigid boards, items 3 and 4 above are called out separately in the stack-up diagram. • Polyimide: This would be the innermost core material in a rigid/flex (type 4). Normal board stack-ups would replace items 1 and 9.

It gets complicated, so we'll leave it at that. • Base metal • Plate-up Metallization • PSA (Pressure Sensitive Adhesive): Normal people call it glue. • Stiffener Yes, all of this is for one-third of a two-layer flex.

Zone 2 the 'Flex' Here's where the rules get interesting. It bends, twists, folds spindles, mutilates and mutates. Ok, the last few were just for fun, but you get the idea. The flexing comes in two flavors, static and dynamic. Static bending is also known as flex to assemble, and it's just what it sounds like; a one-time bend to put the assembly together. Dynamic flexing is common in robotics and laptops among other things. Seriously, how do you think the signals from your camera reach the CPU?

Tiny flexes run right through the hinges. Every motherboard has half a dozen or more flexes.

So, anywhere the FPC flexes becomes a stress riser. Ideally, your traces will not make any turns in the flex zone.

Otherwise, they'd eventually peel up. Wider traces might split be into two or more thinner traces. It's more flexible that way. Another trick is to change from a ground plane to a ground mesh resembling a chain-link fence through the bend regions or often the whole flex - aside from the stiffened zones. For sure, you don't want any vias in or even near where you expect the bending to happen. They'll crack under pressure.

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